The proprietary (patented) filament assembly generates uniform energy distribution, operating at filament temperatures up to 2550°C and power levels up to 20W/cm². The deposition process is controlled by thermal management of both filament and substrate temperatures, in conjunction with closed-loop pressure and gas flow control. Substrate temperatures are measured by thermocouples below the substrates. Filament temperature is measured with a fixed-position, 2-color pyrometer.

The gas distribution assembly allows control of the gas flow patterns in and around both the filament assembly and the substrates to optimize deposition rates, as well as coating uniformity and quality. Adequate space is provided in the deposition chamber to avoid undesirable gas recombination at the chamber walls.

Changes in process step parameters and step times can be utilized to alter nucleation density, growth rate, grain size, and other characteristics to produce coatings with markedly different morphology (see photos opposite). Small-grain coatings can be produced for finish applications or wear surfaces. Large-grain, thick coatings can be produced for rough cutting or long-life tool applications. No hardware or software modifications are required to switch from one type of coating to another, merely the selection of a different recipe.

Each process can be tailored to provide the optimum coating for a given application, and this coating can be reproduced again and again.


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